multilayer pcb manufacturing process 6 layer pcb fabrication FR4 tg170 material

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Shenzhen Hengxunda Circuit Technology Co.,LTD

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multilayer pcb manufacturing process 6 layer pcb fabrication FR4 tg170 material

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multilayer pcb manufacturing process 6 layer pcb fabrication FR4 tg170 material

Process Capability And Checking Parameters(Hard Board) NO ITEM Technical Capabilities 1 Layers 1-38L 2 Max.Board Size 1200*610mm 48"*24" 3 Finished Board Thickness 0.2mm--10.0mm 0.008"-...

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